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orcad in gördüğüm en kapsamlı kitabı umarım işinize yarar.
kitap ingilizce ve 39314 kb dır.

ıntroductıon to pcb desıgn and cad ...............................................1
computer-aided design and the orcad design suite ................................1
printed circuit board fabrication ...................................................................2
pcb cores and layer stack-up ...................................................................2
pcb fabrication process ............................................................................4
photolithography and chemical etching .................................................5
mechanical milling ....................................................................................8
layer registration ......................................................................................9
function of orcad layout in the pcb design process ...............................11
design files created by layout ....................................................................14
layout format fi les (.max) .....................................................................14
postprocess (gerber) fi les .......................................................................14
pcb assembly layers and fi les ................................................................14
chapter 2
ıntroductıon to the pcb desıgn flow by example .............................17
overview of the design flow ......................................................................17
creating a circuit design with capture .......................................................17
starting a new project ............................................................................17
placing parts ............................................................................................20
wiring (connecting) the parts ................................................................23
creating the layout netlist in capture ..................................................23
designing the pcb with layout ...................................................................25
starting layout and importing the netlist ............................................25
making a board outline ..........................................................................29
placing the parts .....................................................................................31
autorouting the board ...........................................................................32
manual routing .......................................................................................32
cleanup ....................................................................................................34
locking traces ..........................................................................................34
performing a design rule check .............................................................35
postprocessing the board design for manufacturing ...........................35
chapter 3
project structures and the layout tool set .....................................39
project setup and schematic entry details .................................................39
capture projects explained ....................................................................39
capture part libraries explained ............................................................42
understanding the layout environment and tool set ..............................43
board technology fi les ............................................................................43
the autoeco utility ................................................................................44
the session frame and design window ................................................46
the toolbar ..............................................................................................47
controlling the autorouter .....................................................................57
postprocessing and layer details ...........................................................60
chapter 4
ıntroductıon to ındustry standards .................................................65
ıntroduction to the standards organizations .............................................66
contents
iv
ınstitute for printed circuits (ıpc-association connecting
electronics ındustries) .......................................................................66
electronic ındustries alliance (eıa) ........................................................66
joint electron device engineering council (jedec) ..............................66
ınternational engineering consortium (ıec) .........................................67
military standards ..................................................................................67
american national standards ınstitute (ansı) .....................................67
ınstitute of electrical and electronics engineers (ıeee) ........................67
classes and types of pcbs ............................................................................68
performance classes ................................................................................68
producibility levels ..................................................................................68
fabrication types and assembly subclasses ..........................................69
orcad layout design complexity levels—ıpc
performance classes ..........................................................................69
ıpc land pattern density levels ..............................................................70
ıntroduction to standard fabrication allowances .....................................70
registration tolerances ...........................................................................70
breakout and annular ring control ........................................................70
pcb dimensions and tolerances ..................................................................71
standard panel sizes ...............................................................................71
tooling area allowances and effective
panel usage .......................................................................................72
standard fi nished pcb thickness ............................................................72
core thickness .........................................................................................73
prepreg thickness ....................................................................................73
copper thickness for pths and vias .......................................................73
copper cladding/foil thickness ...............................................................74
copper trace and etching tolerances ..........................................................75
standard hole dimensions ...........................................................................76
soldermask tolerance ...................................................................................77
end note ........................................................................................................77
suggested reading ..................................................................................77
other items of interest ...........................................................................77
contents
v
chapter 5
ıntroductıon to desıgn for manufacturıng ......................................79
ıntroduction to pcb assembly and soldering processes ............................79
assembly processes ......................................................................................79
manual assembly processes ...................................................................79
automated assembly processes (pick and place) .................................80
soldering processes ......................................................................................81
manual soldering ....................................................................................81
wave soldering .......................................................................................82
refl ow soldering .....................................................................................84
component placement and orientation guide ..........................................85
component spacing for through-hole devices ..........................................86
discrete thds ..........................................................................................86
ıntegrated circuit through-hole devices ................................................86
mixed discrete and ıc through-hole devices ........................................86
holes and jumper wires ..........................................................................86
component spacing for surface-mounted devices .............................86
discrete smds .........................................................................................86
ıntegrated-circuit smds ..........................................................................86
mixed discrete and ıc smds ...................................................................86
mixed thd and smd spacing requirements ..............................................86
footprint and padstack design for pcb manufacturability .......................94
land patterns for surface-mounted devices ..............................................94
smd padstack design .............................................................................96
smd footprint design .............................................................................99
land patterns for through-hole devices ..................................................101
footprint design for through-hole devices .........................................101
padstack design for through-hole devices ..........................................103
hole-to-lead ratio .................................................................................103
pth land dimension (annular ring width) ...........................................104
clearance between plane layers and pths .........................................106
soldermask and solder paste dimensions ...........................................107
contents
vi
chapter 6
pcb desıgn for sıgnal ıntegrıty ....................................................109
circuit design ıssues not related to pcb layout ......................................109
noise ......................................................................................................109
distortion ...............................................................................................110
frequency response ..............................................................................111
ıssues related to pbc layout ...............................................................111
electromagnetic ınterference and cross talk ......................................111
magnetic fi elds and inductive coupling ..............................................112
loop inductance ....................................................................................115
electric fi elds and capacitive coupling .................................................117
ground planes and ground bounce ..........................................................119
what ground is and what it is not ......................................................119
ground (return) planes .........................................................................122
ground bounce and rail collapse .........................................................123
split power and ground planes ...........................................................125
pcb electrical characteristics ......................................................................127
characteristic impedance .....................................................................127
refl ections .............................................................................................133
ringing ...................................................................................................137
electrically long traces ..........................................................................139
critical length ........................................................................................142
transmission line terminations ............................................................143
pcb routing topics .....................................................................................144
parts placement for electrical considerations .....................................145
pcb layer stack-up ................................................................................146
bypass capacitors and fanout ..............................................................151
trace width for current carrying capability ........................................151
trace width for controlled impedance ................................................153
trace spacing for voltage withstanding ..............................................163
trace spacing to minimize cross talk (3w rule) ...................................163
traces with acute and 90º angles ........................................................164
contents
vii
chapter 7
makıng and edıtıng capture parts .................................................167
the capture part libraries ..........................................................................167
types of packaging .....................................................................................168
homogeneous parts .............................................................................168
heterogeneous parts ............................................................................169
pins ...............................................................................................................169
part editing tools ........................................................................................170
the select tool and settings .................................................................170
the pin tools ..........................................................................................170
the graphics tools .................................................................................171
the zoom tools ......................................................................................171
constructing capture parts ........................................................................171
method 1: constructing parts using the new part option (design
menu) .....................................................................................................172
design example for a passive, homogeneous part ............................172
design example for an active, multipart, homogeneous
component ......................................................................................180
assigning power pin visibility .............................................................183
design example for a passive, heterogeneous part ...........................184
method 2: constructing parts with capture using the design
spreadsheet ...........................................................................................187
method 3: constructing parts using generate part from the tools
menu ......................................................................................................190
method 4: generating parts with the pspice model editor .....................192
generating a capture part library from a pspice model
library ...............................................................................................193
making and/or obtaining pspice libraries for making new
capture parts ...................................................................................194
downloading libraries and/or models from the ınternet ..................195
making a pspice model from a capture project .................................196
adding pspice templates (models) to preexisting capture parts .....206
constructing capture symbols ..................................................................208
contents
viii
chapter 8
makıng and edıtıng layout footprınts ...........................................211
ıntroduction to the library manager ........................................................211
ıntroduction to layout’s footprint libraries and naming
conventions ....................................................................................212
layout’s footprint libraries ...................................................................213
naming conventions .............................................................................213
the composition of footprints ..................................................................217
padstacks ...............................................................................................217
obstacles ...............................................................................................218
text ........................................................................................................220
datums and insertion origins ...............................................................220
the basic footprint design process ...........................................................221
working with padstacks .............................................................................226
accessing existing padstacks ...............................................................227
editing padstack properties from the spreadsheet ............................228
saving footprints and padstacks .........................................................229
footprint design examples ........................................................................231
design example 1: a surface-mount footprint design .......................232
design example 2: a modifi ed through-hole footprint
design ..............................................................................................237
using the pad array generator ..................................................................243
ıntroduction ...........................................................................................243
footprint design for pgas ....................................................................243
footprint design for bgas ....................................................................248
blind, buried, and microvias .................................................................258
mounting holes .....................................................................................259
printing a catalog of a footprint library ..............................................261
chapter 9
pcb desıgn examples ....................................................................263
overview of the design flow ....................................................................264
contents
ix
example 1: dual power supply, analog design .......................................266
ınitial design concept and preparation ...............................................267
project setup and design in capture ...................................................268
defi ning the board requirements ........................................................285
ımporting the design into layout ........................................................288
setting up the board ............................................................................289
prerouting the board ............................................................................306
autorouting the board .........................................................................316
finalizing the design .............................................................................318
example 2: mixed analog/digital design using split power, ground
planes .....................................................................................................322
mixed-signal circuit design in capture ................................................322
power and ground connections to digital and analog parts .............324
connecting separate analog and digital grounds to a
split plane ........................................................................................324
using busses for digital nets ................................................................327
defi ning the layer stack-up for split planes .......................................328
establishing a primary power plane ....................................................330
creating split ground planes ................................................................334
creating nested power planes with copper pours .............................336
using anti-copper on plane layers .......................................................338
setting up and running the autorouter ..............................................340
moving a routed trace to a different layer .........................................342
adding ground planes and guard traces to routing layers ...............342
defi ning vias for fl ood planes/pours ...................................................345
setting the copper pour spacing .........................................................347
stitching a ground plane manually .....................................................348
using anti-copper obstacles on copper pours ....................................349
routing guard traces and rings ...........................................................349
example 3: multipage, multipower, and multiground mixed a/d
pcb design with pspice ........................................................................352
project setup for pspice simulation and layout .................................354
adding schematic pages to the design ...............................................356
contents
x
using off-page connectors with wires ................................................358
using off-page connectors with busses ..............................................359
setting up multiple-ground systems ...................................................359
setting up pspice sources .....................................................................360
performing pspice simulations ............................................................361
preparing the simulated project for layout ........................................364
assigning a new technology fi le .........................................................365
placing parts on the bottom (back) of a board ...................................365
layer stack-up for a multiground system ...........................................365
net layer assignments ..........................................................................367
through-hole and blind via setup .......................................................367
fanning out a board with multiple vias ..............................................367
overriding known errors in layout .....................................................370
autorouting with the drc/route box ..................................................370
using forced thermals to connect ground planes ..............................372
using the autoeco to update a board from capture ........................372
example 4: high-speed digital design ......................................................376
layer setup for microstrip transmission lines .....................................380
via design for heat spreaders ..............................................................381
constructing a heat spreader with copper area obstacles ................382
using free vias as heat pipes ...............................................................382
determining critical trace length of transmission lines .....................387
routing controlled impedance traces ..................................................388
moated ground areas for clock circuits ...............................................390
routing curved traces ...........................................................................390
gate and pin swapping ........................................................................392
stitching a ground plane with the free via matrix .............................395
miscellaneous ıtems ....................................................................................397
fixing bad pad exits ..............................................................................397
design cache—cleanup, replace, update .............................................398
adding test points ................................................................................400
types of autoecos ...............................................................................401
contents
xi
making a custom capture template ....................................................403
making a custom layout technology/template fi le ...........................403
using the stackup editor ............................................................................404
using the stackup editor with an active board design ......................404
using the stackup editor to set up a custom technology or
template fi le ....................................................................................407
submitting stack-up drawings with gerber fi les ...............................408
adding solder thieves ...........................................................................408
printing a footprint catalog from a pcb design ..................................409
chapter 10
postprocessıng and board fabrıcatıon ............................................411
the circuit design with orcad ..................................................................411
schematic design in capture ................................................................411
the board design with layout .............................................................413
postprocessing the design with layout ..............................................414
fabricating the board .................................................................................417
choosing a board house .......................................................................417
setting up a user account .....................................................................417
submitting gerber fi les and requesting a quote ................................418
annotating the layer types and stack-up ...........................................419
receipt inspection and testing .............................................................422
nonstandard gerber fi les .....................................................................422
chapter 11
addıtıonal tools ..........................................................................423
using pspice to simulate transmission lines ...........................................423
simulating digital transmission lines ..................................................424
simulating analog signals ....................................................................427
using microsoft excel with a bill of materials generated by
capture ..................................................................................................427
using the specctra autorouter with layout ..........................................429
contents
xii
ıntroduction to gerbtool ............................................................................437
opening a layout-generated gerber fi le with gerbtool ..................437
making a .drl fi le for a cnc machine .................................................438
panelization ...........................................................................................443
using the ıpc-7351 land pattern viewer ..................................................449
using cad tools to 3-d model a pcb ........................................................452

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